Exhibitor details
CiS Forschungsinstitut für Mikrosensorik GmbH
Catalogue entry
CiS Forschungsinstitut für Mikrosensorik GmbH is a privately organized, non-profit, business-oriented research institution with about 120 employees. We are one of the leading institutes for the development of high-quality, silicon-based microsensors and microsystems, especially in the fields of MEMS and MOEMS.
Together with its partners from research and industry, the CiS Research Institute creates new innovations for the technical challenges of our time. In close cooperation with politics and science, the CiS Research Institute actively takes responsibility for the transfer of knowledge and the exploitation of research results regarding novel and powerful technologies to increase the innovative power of our economy.
Silicon-based sensors are the main focus of our research and development tasks for industry and science. Starting with application-specific design, process development, assembly and interconnection technology up to the precisely fitting solution, including comprehensive measurement technology and analytics, our portfolio presents the entire value chain. Our focus is on long-term stability, precision and high reliability of the sensors.
Based on more than 30 years of "Competence in Silicon", our expertise includes R&D services, prototyping as well as small series production of customized micro components.
From design to prototyping.
Reliable. Long-term stable. Precise.
Product groups
- D.01.03.01
- Process and technology simulation
- D.02.01
- Strain gauge technology
- D.01.02.04.02
- Mechanical parameter
- D.01.02.04.04
- Thermal parameter
- S.02.04
- Piezoresistive sensing element
- D.01.02.04.08
- Optical parameter
- D.01.02.08.08
- Microstructuring of silicon
- D.01.02.08.09
- Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS
- D.02.12
- Microsensor technology
- D.01.02.04.14
- Medical parameter
- D.01.02.04.16
- Gas concentration
- D.01.02.08.17
- Microoptics, integrated optics
- D.02.19
- Assembly and packaging
- D.01.02.08.19
- Assembly and packaging
- S.02.25
- Optoelectronic element
- D.02.42
- Prototype manufacture
Product news
| Product news | DE | EN | Date |
|---|---|---|---|
| Tandem diodes for standing wave interferometers | Jun 3, 2024 | ||
| High-end acceleration sensors (HEB) | Jun 3, 2024 |
