Exhibitor details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Your voucher code: ST2026A50116.
Catalogue entry
At the Fraunhofer joint booth, Fraunhofer IZM will present energy-efficient technologies for highly miniaturized sensor systems (Green ICT). On display will be industry-oriented solutions and research results on innovative hardware concepts, radar sensor technology, as well as advanced packaging, smart system integration, and photonics in thin glass at the panel and wafer levels - with a focus on scalability, integration, and application potential for industrial systems.
Product groups
- D.01.04.01
- Assembly and packaging
- D.01.01
- General IT, software, hardware services
- D.01.04.02
- Packaging
- D.01.04.07
- System development wireless sensor network
- D.02.43
- Prototype manufacture
Product news
| Product news | DE | EN | Date |
|---|---|---|---|
| Thin glass interposer for biomedical and telecom application | Mar 27, 2026 | ||
| Sensors for retrofitting industrial plants | Mar 27, 2026 | ||
| Hybrid pixel detector module with silicon sensor for use in X-ray exams | Mar 27, 2026 |
