Product news

ES Systems has developed a series of board mountable pressure sensors targeting a variety of markets requiring high resolution and accuracy for absolute, gauge or differential pressure measurements. The ESCP-BMS1 is a MEMS capacitive pressure sensor with state-of-the-art performance. The MEMS pressure sensor die is underpinned by ES Systems’ innovative SOI-surface micromachining technology.

ESCP-BMS1 is an absolute, gauge or differential pressure sensor of ultrahigh resolution with analog, SPI or I2C interface. The output is fully calibrated, and temperature compensated based on the internal temperature sensor and the factory calibration coefficients which are stored in the embedded memory. The sensor is ready to be installed directly to the end system without further processing. The total error including repeatability, hysteresis, non-linearity, thermal offset, and calibration error between 0oC and 60oC is better than 0.25% FS.

Different power modes are available enabling low power operation. The sensor can be configured to provide both high accuracy 32-bit pressure and temperature outputs.

ESCP-BMS1 is a silicon capacitive pressure sensor with excellent long-term stability. The sensor is incorporated in a standard 8-pin DIP package with a single or two pneumatic ports. The top port is the high-side, and the bottom port is the low-side.

Specifications:
Pressure Type: Absolute, Gauge, Differential
Pressure Range, Absolute: 200mbara … 10bara
Pressure Range, Gauge: 0barg … 11barg
Pressure Range, Differential: ±10mbar … ±1bar
Power Supply: 3.3V
Current Consumption, full operation: < 1mA
Accuracy: ±0.15% FSS
Total Error Band: ±0.25% FSS
Operating Temperature: -20C … +85C
Compensation Temperature: 0C … +60C, -20C … +85C
Digital Output: Calibrated Pressure & Temperature
Analog Output: Calibrated Pressure
Overpressure Tolerance:Up to 100x
Media Compatibility: Gases