Exhibitor details
LCP Laser-Cut-Processing GmbH
Catalogue entry
Laser-made solutions.
For 30 years, we have been operating as a competence center for laser precision machining of special materials. Our customers from the fields of sensors & systems, power electronics, e-mobility & energy as well as precision mechanics & equipment manufacturing rely on us for the production of individual fine and micro-precision components for their applications. As a reliable manufacturing service provider and agile development partner, we are at your side with our complete service from initial consultation to prototype production and possible series production along the entire process chain.
"The more filigree a layout and the more sensitive a material, the higher the demands on the manufacturing of the product."
In addition to the application diversity of laser technologies (including laser fine cutting, laser fine welding or laser structuring), our expertise lies in the individual processing and procurement of special materials. The spectrum ranges from high-performance ceramics (Al2O3, AlN, SiC, SiN, 3YSZ) to glass and silicon wafers to organic printed circuit board material. Non-ferrous and refractory metals, high-performance plastics as well as films - half as strong as a human hair - are also among our "specialties". Sensitive materials such as these place high demands on the actual manufacturing process of the required components, which often challenge with extremely filigree layout specifications and are later used in highly sensitive areas of application.
We offer suitable conditions for processing and manufacturing by laser beam. Thanks to the many years of experience of our competent team, laser precision manufacturing of these products is our specialty. Together with our customers, we always find the right solution for their demanding project.
We manufacture and/or process according to customer requirements, among others:
- ceramic substrates, fillers, bases and other ceramic components
- printed circuit boards (rigid/flexible)
- micro screens, grids, filters
- busbars, leadframes, flat contacts, contact springs, contact bridges, connectors, single pins, injection molded inserts
- sensor housings, EVM housings, covers
- rotor/stator laminations and stacks
- dies, fixture construction
...
Our strengths - your advantages
In addition to laser processing, our range of services is complemented by mechanical finishing technologies: wafer dicing, milling, turning, bending/edging, brushing as well as precision finishing and glass bead blasting complete our range of services. In addition to pure component manufacturing, our customers can also benefit from our additional services:
- consulting + intensive process support (sampling)
- pure material procurement (also without machining, smallest quantities, special materials)
- services: order measurement, component cleaning
- research & development (joint projects, process development)
- extensive network of cooperation partners (surface finishing, alternative machining processes, etc.)
We can implement specific customer requirements individually and precisely thanks to our own machine and equipment construction as well as adapted automation solutions. With our own R&D department, we also drive future developments and always stay up-to-date thanks to strong networking with research institutions and universities.
You too can benefit from the advantages of laser precision machining and our know-how for your specific project. We look forward to new challenges.
Our services at a glance:
- laser fine cutting
- laser structuring (ultra-short pulse machining)
- laser drilling
- laser scribing
- laser fine welding
- laser marking
Further (re)processing options:
- wafer dicing
- mechanics (turning, milling)
- precision bending
- vibratory grinding
- glass bead blasting
- order measurement
All further information can be found at https://www.lcpgmbh.de!
LCP Laser-Cut-Processing
Laser-made solutions.
Product groups
- S.03.04
- Ceramic raw material
- S.03.05
- Ceramic component
- D.02.27
- Laser processing
- D.02.31
- Micro drilling
- D.02.32
- Micro welding