Product news

NVE’s wafer-level chip-scale package (WLCSP) provides flip-chip-compatible sensors to miniaturize industrial sensors. The 0.6 x 0.6 mm package features sensor-side solder bumps with an array of 120 µm diameter SAC305 balls and is surface-mount technology (SMT) solderable with JEDEC standard reflows – no underfill required. Compared to wirebonded bare die, NVE’s WLCSP sensors are smaller and form more reliable electrical connections.

ADLxxx-Series sensors are Giant Magnetoresistive (GMR) Digital Switches designed to operate from 3.3-volt power supplies or single lithium cells with extremely supply low currents. The devices are manufactured with NVE’s patented spintronic GMR technology and low-power CMOS circuitry for unmatched miniaturization, sensitivity, precision, and low power.

Versions are available that are either continuous duty or internally duty cycled operation to further reduce power consumption. An integrated latch ensures the output is available continuously in duty-cycled versions. The outputs are configured as magnetic switches. Normally-open versions turn on (LOW output) when the magnetic field is applied and off (OPEN output) when the field is removed. Normally-closed versions turn off when a field is applied. The applied field can be of either polarity, and the operate point is extremely stable over supply voltage and temperature. The output is current-sinking, and can sink up to 100 microamps.