Product news

Optical sensor assemblies typically require bonding and filling processes that must meet high optical standards—for example, during die-attach and underfill of optical filters or lenses onto a semiconductor detector. In the current state of the art, minute quantities of liquid adhesives or filling materials are metered and applied individually to the components (= dispensing). This is where the HIVOS project comes in: instead of depositing individual adhesive deposits, entire wafers or other substrates can be pre-coated with structured adhesive layers, enabling a high degree of automation, greater scalability, and faster assembly processes while simultaneously ensuring higher precision in the amounts of adhesive used and their positioning. As part of the project, assembly technologies were developed for various adhesive systems, such as photostructurable adhesives, B-stage adhesives, and sintering films. In this way, the integration of spacers and registration marks was also achieved, and the implementation of stacking technologies at the wafer and panel level was demonstrated using various sensor assemblies.