Exhibitor details
Fraunhofer-Institut für Zuverlässigkeit
und Mikrointegration IZM
Catalogue entry
Fraunhofer IZM presents innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (Green ICT) as well as current research results in the field of advanced packaging and system integration for smart systems.
Product groups
- D.01.04.01
- Assembly and packaging
- D.01.01
- General IT, software, hardware services
- D.01.04.02
- Packaging
- D.01.04.07
- System development wireless sensor network
- D.02.43
- Prototype manufacture
Product news
| Product news | DE | EN | Date |
|---|---|---|---|
| High-end performance packaging | Feb 8, 2024 | ||
| Plug & play platforms for wireless sensors and radar sensors | Feb 8, 2024 |
