Product news

One highlight is our range of piezoelectric and capacitive micromechanical ultrasonic transducers. Together with the Fraunhofer Institutes IPMS and ISIT, we are presenting the next generation of ultrasonic sensor technology from a single source.

We are introducing universal PMUTs that are available at wafer level and can be adapted to the desired chip size (1 mm pitch) according to customer requirements. The chip consists of unit cells of acoustic transducers, which are electrically contacted as required. This arrangement according to the desired shape of the acoustic channel can also be made in a grid pattern, thus enabling multi-array arrangements.

We will also be demonstrating live at our booth the use of a new generation of capacitive ultrasonic transducers in industrial applications for non-destructive testing, material testing for detecting defects in metals, alloys, and plastics, and for material testing.