Product news

LINTEC‘s Bump Support Film (BSF) is designed to enhance the durability and reliability of semiconductor chips by protecting the ball bump interconnections between the die and the substrate.
The BSF uses a film-based resin layer with a special modulus that prevents cracks in the bumps caused by thermal deformation and mechanical stress. It can be applied without the need for new equipment or changes to the manufacturing process, making it easy to integrate into existing processes.
Additionally, BSF can also serve as back-grinding tape, protecting the wafer during the grinding process. Overall, BSF helps improve the performance and longevity of semiconductor packages, especially in advanced electronic devices.
For all the above reasons, LINTEC’s Bump Support Film (BSF) is the ideal solution to make advanced semiconductor packages more robust.