Product news

Fraunhofer IZM is a leader with extensive know-how in the production of high-density flexible or rigid-flex multilayer circuits. By demonstrating a flow sensor for condition monitoring with embedded sensors in rigid/flex technology, the application of wafer level redistribution technology on temporary carrier wafers will be presented.

For synchrotron radiation experiments and X-ray imaging applications, hybrid pixel detector modules are the top class in X-ray cameras. Using an X-ray detector in USB stick format, the department »Wafer Level System Integration« will demonstrate their competence in packaging of such hybrid pixel detector systems.

The following exhibits will also be on display:
• X-Ray Imaging: CdTe Sensor Modul
• Infra-Red Imaging: Micro Bolometer Modul and Wafer
• 2,5D/3D Sensor and Chiplet Integration
• High Density Flex with embedded IC/Sensors: Moduls and Wafer
• FanOut WLP: USeP-Modul

Visit us in hall 1 at booth 1-317 and get in touch with our experts. The Fraunhofer IZM team is looking forward to meeting you!

© Fraunhofer IZM | Volker Mai
X-Ray-Modules