Exhibitor details

VIA electronic manufacture customized LTCC multilayer boards and packages suitable for sensor applications. Other materials like Al2O3 or glass are possible. Typically applications are in industrial, telecommunication, 5G, 6G, space, defense and scientific markets. Applications like X-ray sensor carrier, interposer, sensor elements with ceramic coils or resistors, embedded, buried or on top. RF elements or patch antennas can be integrated. Customized boards, packages and various options of interconnection like BGA, LGA, Leadframe, castellations are possible. VIA offers also a brazing service for frames and heatsinks as well as ceramic capping technologies on waferlevel for hermetic closing.