Exhibitor details

Fraunhofer ISIT at SENSOR+TEST 2026

Fraunhofer ISIT presents innovative technologies for microsystems engineering, sensor technology, and wafer-level integration at SENSOR+TEST 2026. The focus is on highly integrated solutions for next-generation sensing and quantum systems – ranging from PowderMEMS® microstructures to integrated micromagnets and advanced MEMS protection technologies.

Highlights at our booth:
PowderMEMS® Technology for Innovative Microsystems

The patented PowderMEMS® technology enables three-dimensional microstructures directly at wafer level. This allows compact and efficient integration of micromagnets, thermal insulation, and microfluidic structures for magnetic MEMS, microfluidics, and microelectronics applications.

Monolithic Back-Biased Hall Sensor

Together with Fraunhofer IIS, Fraunhofer ISIT presents the world’s smallest back-biased 3D Hall sensor. Integrated PowderMEMS® micromagnets enable highly compact sensor systems without the need for external magnet assembly.

PFAS-Free Environmental Protection Caps for MEMS Sensors

Innovative gas-permeable protection caps safeguard MEMS gas and pressure sensors against particles and humidity. The structures are directly integrated into 8-inch silicon wafers and are completely PFAS-free.

Integrated Micromagnets for NV Quantum Sensors

Fraunhofer ISIT showcases high-performance PowderMEMS® micromagnets for highly compact NV-based quantum sensors. Wafer-level integration enables precise magnetic bias fields for next-generation quantum hardware.

Visit us at SENSOR+TEST 2026 and discover innovative technologies for the next generation of intelligent sensor systems.