Product news

The »Optical Interconnection Technology« research group develops solutions for the integration and interconnection of photonics and electronics. Our teams implement 2D connectivity for electro-optical printed circuit boards as well as 3D connectivity through photonic system assembly.

Thin-glass technologies enable laser-structured, hermetically sealed optical interfaces in stacked packages - scalable in panel and wafer processes. At Sensor+Test 2026, we will showcase, among other things, a glass interposer for photonic integrated circuits. Glass-based, hermetically sealed interposer platform: TGVs for the electrical and optical connection of PICs.

Picture: Thin glass interposer with structured metallization created using wafer-level processes – before assembly with photonic components (and package closure) for biomedical and telecom application (unpopulated).
(c) Fraunhofer IZM I Volker Mai