Product news

Fraunhofer IZM is a global leader in wafer-level system integration. Key technologies for this include the fabrication of vertical through-silicon vias in silicon and glass wafers, as well as high-density multilayer interconnect systems using thin-film technology, on-wafer packaging and encapsulation techniques, and the interconnection of integrated circuits and substrates using ultra-fine metallic contacts.

For experiments with synchrotron radiation and for X-ray imaging, hybrid pixel detector modules are considered state-of-the-art. Using a compact X-ray detector in USB flash drive format, the »Wafer Level System Integration« department demonstrates its expertise in the assembly and interconnection technology of such highly integrated pixel detector systems.

Picture: Hybrid pixel detector module with silicon sensor for use in X-ray exams
(c) Fraunhofer IZM I Volker Mai