Produkt-Neuheit

1. Description
The products are semiconductor laser chips combined with advanced packaging technology. They can be built-in with semiconductor coolers (TEC) and thermistors (NTC), with precise temperature control and stable wavelength.
Heated TO is also available for -10℃~50℃.

2. Features
TO 56/TO 60 heat dissipation integrated packaging structure
Working temperature range: -40-70℃/-10-50℃
Low threshold, high power
Low power consumption, high reliability

3. Application
Home Gas Monitoring
Mini Gas Detection Module
Open-Path Gas Detection System
Industrial Sensor Field