Produkt-Neuheit

Semiconductor process:
Process design
Sensor layout
Semiconductor technologies for piezoresistors
Test structures

MEMS technology:
3D structuring (wet and dry etching)
Bonding (anodic and silicon direct bonding)
Dicing
Testing (probing, optical inspection)

Test and qualification:
Performance test
Long term stability test
Burst and overpressure test
Pull and shear testing
Qualification for piezoresistive elements

Packaging:
Automatic die bonding
Automatic wire bonding
Glass soldering/printing
Annealing
Aging processes (pT)
He-Leak test


Customization:
Adjustable sensitivity
Customized designs
Oil filling
Membrane stamping
CNC precision machining
TIG, resistance and laser welding
Test on customer requirements