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Höchste Integrationsdichte auf kleinster Grundfläche durch Stacked-Die-Packages von MSE

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Apart from the sensor itself, modern sensor systems very often contain data processing and data transmission modules. The need for increased functional density coupled with miniaturization can be met with the three-dimensional integration of multiple ICs or dies.

Micro Systems Engineering GmbH (MSE) offers all manufacturing technologies for producing customized stacked die ball grid arrays of this kind – even in small to medium volumes. Two or three ICs can be integrated into this type of package.

The process chain consists of substrate preparation, die attachment, wire bonding, transfer molding, laser marking, and singulation.

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