Exhibitor details
CiS Forschungsinstitut für Mikrosensorik GmbH

Catalogue entry
CiS Forschungsinstitut für Mikrosensorik GmbH is a privately organized, non-profit, business-oriented research institution with about 120 employees. We are one of the leading institutes for the development of high-quality, silicon-based microsensors and microsystems, especially in the fields of MEMS and MOEMS.
Together with its partners from research and industry, the CiS Research Institute creates new innovations for the technical challenges of our time. In close cooperation with politics and science, the CiS Research Institute actively takes responsibility for the transfer of knowledge and the exploitation of research results regarding novel and powerful technologies to increase the innovative power of our economy.
Silicon-based sensors are the main focus of our research and development tasks for industry and science. Starting with application-specific design, process development, assembly and interconnection technology up to the precisely fitting solution, including comprehensive measurement technology and analytics, our portfolio presents the entire value chain. Our focus is on long-term stability, precision and high reliability of the sensors.
Based on 30 years of "Competence in Silicon", our expertise includes R&D services, prototyping as well as small series production of customized micro components.
From design to prototyping.
Reliable. Long-term stable. Precise.

Product groups
- D.02.01
- Strain gauge technology
- D.01.03.01
- Process and technology simulation
- D.01.02.04.02
- Mechanical parameter
- S.02.04
- Piezoresistive sensing element
- D.01.02.04.04
- Thermal parameter
- D.01.02.08.08
- Microstructuring of silicon
- D.01.02.04.08
- Optical parameter
- D.01.02.08.09
- Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS
- D.02.12
- Microsensor technology
- D.01.02.04.14
- Medical parameter
- D.01.02.04.16
- Gas concentration
- D.01.02.08.17
- Microoptics, integrated optics
- D.01.02.08.19
- Assembly and packaging
- D.02.19
- Assembly and packaging
- S.02.25
- Optoelectronic element
- D.02.42
- Prototype manufacture
Product news
Product news | DE | EN | Date |
---|---|---|---|
Segmented infrared detectors | Mar 29, 2023 | ||
UV detectors with integrated amplification | Mar 29, 2023 | ||
Touch probe with greatly reduced probing force for determining the instrumented indentation hardness | Mar 29, 2023 | ||
BAVI - Determination of the operating force of fasteners | Mar 29, 2023 | ||
Analog, integrated temperature compensation for high-temperature applications (AniTHA) | Mar 29, 2023 | ||
Tandem diode | Mar 29, 2023 | ||
Low energy electron detector | Mar 29, 2023 | ||
Microsensor detection of the direction of light incidence | Mar 29, 2023 | ||
IR components for gas sensing and temperature measurement | Mar 29, 2023 |