Produkt-Neuheit

When cutting and removing silicon wafers, especially large 12" wafers, maximum precision is required with the smallest contours on an extended surface. The classic mechanical method of wafer dicing reaches its limits here, as it cannot meet the requirements for fineness and precision. This is precisely where the use of USP laser technology with a spectral range of typically 1µm scores points in the processing of silicon

Advantages of USP laser processing for silicon wafers:
The use of ultrashort pulse lasers in the aforementioned spectral range enables extremely fine and precise processing of silicon wafers. This innovative technology produces highly complex structures with maximum precision, even on large surfaces, which is of crucial importance for applications in the semiconductor industry. By dispensing with the mechanical processing steps of wafer dicing and instead making targeted use of USP laser technology with a wavelength of 1 µm, the silicon wafer is no longer exposed to mechanical stress, thereby avoiding potential damage such as chipping and cracks in the material. The advantage of USP laser technology lies in the extremely short pulses, which do not cause any thermal input and therefore no damage to the material. In addition, processing with the USP laser has a smaller kerf width, which results in less kerf loss and therefore a higher yield of chips per wafer compared to wafer dicing. This results in a more efficient use of the wafer material and contributes to cost savings. The process is also characterized by high speed, which leads to significantly shorter processing times and thus increases productivity. Two further decisive advantages over the previous mechanical process are the reduced need for post-processing steps, as there is no burr formation or melt adhesion, and the elimination of a liquid cooling medium, which reduces resource consumption and wafer contamination at the same time. In addition, laser processing enables free-form contours including 3D processing, which is particularly important for the creation of cavities, channels, inclined planes and blind holes.

In summary, USP laser processing not only offers a precise solution to the challenges of silicon wafer processing, but also optimizes the efficiency, sustainability and quality of the entire process.

Versatile applications for USP laser technology:
LCP has been successfully using USP laser technology for its customers for years for the micromachining of all materials and can draw on sound knowledge. In addition to the processing of silicon wafers, a wide range of other applications are possible:
• Cutting the thinnest foils without distortion with the smallest web widths and slots
• Insertion of predetermined breaking points in brittle-hard materials for subsequent separation
• Creation of microstructures in materials that are difficult to etch or cut
• Structuring/decoating of coated components
• Creation of defined surface structures for special molding, adhesion and friction properties
• Introduction of special surface geometries with shallow depths to improve friction properties
• Laser drilling of micro-holes, also in multiple arrangements
• Cutting of ceramic and metallic materials without thermal interaction
• Cutting of glass wafers from materials such as Borofloat® 33, D 263® T eco, AF 32®, AS87®, MEMpax®, BK7 and quartz glass
• Clean, stress-free processing of plastics/ PCB materials (FR3, FR4, FR5, polyimide, Kapton®/ Pyralux®) without carbonization of the cut edges